Date: Thursday, 9 May 2013
Time: 9:15 - 15:20
Venue: TECH West Stage
MEMS devices have been proliferated across a broad range of applications including medical, wireless (including cellular and network technologies), biotechnology, computer, automotive and aerospace industries. In spite of rapid advances in the field of MEMS, there are major issues impeding its commercial success. One key challenge that has daunted companies is the transition from prototype to volume manufacturing – most companies have limited access to design and process expertise, as well as manufacturing.
This Forum invites leading players in the MEMS industry to share their strategies to bridge the gap from R&D to manufacturing and a business model that minimizes risk and cost for companies who want to move beyond proof-of-concept to volume production, paving the way for prototype-stage devices to make a successful transition to volume manufacturing.
- Morning Session: Dr. Janak Singh, Senior Manager, Institute of Microelectronics
- Afternoon Session: Dr. Tang Min, Industry Development Manager, Institute of Microelectronics, A*STAR
09:15 – 09:25
09:25 – 09:50
MEMS Market/Industry Trends
Mr Pascal Viaud, Chief Technology Officer, Yole Développement, Taiwan
09:50 – 10:15
10:15 – 10:40
10:40 – 10:50
Break Time & Networking
10:50 – 11:15
Large Volume MEMS Manufacturing
Mr Rakesh Kumar, Sr. Director (MEMS)
11:15 – 11:40
11:40 – 12:05
MEMS Packaging: Foundry Perspective & Prospective
12:05 – 13:05
Lunch Time & Networking
|13:05 – 13:30|
13:30 – 13:55
Low Temperature (sub-200°C) PECVD dielectrics for MEMSMr David Butler, Vice President, Marketing, SPTS Technologies
|13:55 – 14:20|
|14:20 – 14:45|
14:45 – 15:10
15:10 – 15:20
* Programs and timing are subject to change without prior notice.
Dr. Janak Singh currently holds the position of Senior Manager, MEMS Industry Development at Institute of Microelectronics (IME), Singapore. His interests include marketing and business development for IME’s MEMS portfolio, which include full suite of MEMS R&D services starting from concept, design, fabrication, ASIC, package and characterizations. He got his Ph.D. from Indian Institute of Technology in 1998 & MBA from NUS Business School in 2008. His research interests includes optical MEMS, bio MEMS and other physical MEMS such as inertial and MEMS for medical applications. He has close to 60 scietific publications and 7 patents. <Top>
Dr. TANG Min is currently serving as Senior Manager, Industry Development at Institute of Microelectronics (IME), A*STAR, Singapore, where she markets IME’s MEMS portfolio and manages the business development with customers from US, Europe, Japan, China and Taiwan.
She received her BEng in polymer material science and engineering and MSc degree in microelectronics & solid-state electronics from Shanghai Jiao Tong University in 1998 and 2001, respectively, and a PhD degree in microelectronics & MEMS technology from Nanyang Technological University, in 2007. She has authored ~40 technical papers in peer reviewed journals and proceedings and holds 5 patents, concerning magnetic MEMS, RF MEMS, CMOS BEOL / MEMS process integration and packaging.
Leopold Beer joined Bosch Sensortec shortly after its foundation in 2006 and has been working as a sales director and afterwards global marketing director. Since March 2013 he is the Regional President of Asia Pacific.
Dr. Alex Gu is the Director of Technical Marketing, Miniaturised Medical Devices (MMD), at the A*STAR Institute of Microelectronics (IME). He spent 10 years in the Honeywell Sensors and Wireless Lab as a principal research scientist before joining A*STAR Institute of Microelectronics. His industrial research covers broad areas include chemical and biosensors, ultrasound, chip-level thermal management, chip-level vacuum systems, and deeply miniaturized medical equipments.
Alex was the Principal Investigator and/or Program Manager for various
externally funded research programs totaling >$15M
|Giuseppe Noviello is the Marketing Director for Human to Machine Interface products in the High-End Sensor & Analog Division that is part of Analog, MEMS & Sensor Group of STMicroelectronics since December 2009.|
In 1994 Giuseppe Noviello joined STMicroelectronics in Catania Italy working on new analog products definition and application. In 2004 he was appointed Technical Marketing Manager of the Advanced Analog and Logic BU with HQ in Singapore to work in the roadmap definition of new analog products for various application fields.
In 2009, Giuseppe Noviello joined AMS Group and he became Marketing Director for Sensor and MicroActuators products with main focus on touch screen controllers. In this position, he participated to the development of a MEMS magnetic switch with IME for mobile and consumer application.
Giuseppe Noviello filed more than 8 patents in the human to machine interaction and related sensors applications.
Giuseppe Noviello was born in Bari Italy in 1966. He holds the M.S. degree in electronic engineering, major optoelectronics, from the Technology University of Bari. <Top>
Ranjan is currently a Principal Engineer , OSAT supply chain management / turnkey engineering with Globalfoundries. Prior to joining he have been working with A-star Institute of Microelectronics (IME) for 15 years in Microsystem, Design & Simulation task. His area of research was 2.5D, 3DIC using TSVs, ultra thin chip embedding and wafer level packaging. His expertise are characterisation of mechanical & moisture properties of electronics packaging materials. He has set up new & novel experimental techniques to characterise electronics packaging materials, assembly process interaction & accelerated reliability, drop, impact and vibration testing.
A*STAR Institute of Microelectronics
Dr. Sunil Wickramanayaka is the Director of
Interconnects and Advanced Packaging (IPP) – Special Projects, at the A*STAR
Institute of Microelectronics. He has 22 years of experience in the
semiconductor industry. His extensive experience includes the design and
manufacturing of FEOL and BEOL semiconductor equipment, particularly for dry
etching, CVD and wafer bonding applications, as well as the development of
semiconductor and MEMS packaging technologies, including 3D / 2.5D integration
with Through-Silicon Vias (TSV).
Sunil has authored over 100 research publications and holds more than 40 patents. He received his Ph.D. in Optoelectronics Engineering from Shizuoka University, Japan in 1992 and an MBA from the University of Southern Queensland, Australia in 2006.
David Butler currently serves as the Vice President Marketing at SPTS Technologies. With 22 years of experience in the semiconductor capital equipment and related industries, he first joined Electrotech in 1988 as a Senior Process Engineer, and subsequently moved into a product marketing role, managing PVD products. In 2004, he assumed the position of Director of Marketing for the PVD/Etch/CVD products at Trikon Technologies. Following the merger of Trikon and Aviza in 2006, he was appointed Vice President of Marketing for Aviza Technology.
From 1995 to 2006 Igor Eichinger was working in the automotive branch. He switched to Siconnex in january 2007. At Siconnex he is the Head of the Process Engineering Department. In the laboratory. he is responsible for developing and testing wet chemical processes such as etching, stripping and cleaning. <Top>
After graduating from Tokyo Institute of Technology with a BS in Physics, Mr. Fred Ishii joined Sony Corporation in 1970 and remained with them for 34 years through the era of Sony's developing and dominating the Television Industry. He started as a factory engineer and worked for display R&D in his early career. During the 1980's and 1990's, Mr. Ishii was assigned to start-up and develop Sony’s American factories. At the peak of his career at Sony, he was responsible for the vertical integration of high-margin components such as the Shadow Mask and CRT Glass by way of organic development and joint ventures. The success lead to Sony’s TV share in U.S. to the top position. After 30 years of factory start-up and technology development for Sony Corporation, Mr. Ishii joined and led Sony Venture Capital in Silicon Valley. His dual track mind of science and engineering was quickly absorbed by the spirit of Silicon Valley, the world's center of innovation and entrepreneurship. Since retiring Sony Corporation, he has turned his endeavors to continue researching display devices at his own desk. The resulting patents are the genesis of his company. Mr. Ishii continued to maintain his relationship with Sony as a contracted technology advisor and a friend to the firm. <Top>
Director of the NXP Research Asia Lab. Michael has more than 25 years of experience in all aspects of semiconductor research and development, plus also in production. Michael has specialized in CMOS, BiCMOS, LDMOS process integration and process development. Michael has worked for NXP Semiconductors and Philips in various process R&D roles in the Netherlands, France, Switzerland and Singapore. <Top>
Mr Leopold Beer, Regional President Asia-Pacific, Bosch Sensortec GmbH
MEMS, tiny micro-electro-mechanical systems that function as miniature machines, are showing up in all facets of our daily lives — in our smartphones, tablets, cameras, laptops, video games! Your favorite consumer product likely contains more than a half-dozen MEMS. From accelerometers and gyroscopes that ‘interpret’ motion into the digital realm, to magnetic compasses, pressure sensors and MEMS microphones, MEMS sensors have dramatically improved the user experience with electronic devices.
Dr. Alex Gu, Director of Technical Marketing - Miniaturised Medical Devices
A*STAR Institute of Microelectronics
The unique characteristics, including small
size, light weight, CMOS compatibility, and mass parallel processing, make MEMS
the ideal technology platform responding to the emerging trends of
modern society. These characteristics enable deep miniaturisation,
ultra low power, multiplexing, and chip-level integration. Being a
critical player in MEMS R&D and an incubator of future MEMS technologies,
In this talk, some of the MEMS-based sensors and microsystems developed in IME for such applications in distributed sensors network, TPMS, and biomedical will be showcased. <Top>
Francesco Italia, General Manager, High-End Sensor & Analog Division, STMicroelectronics
Dr. Sunil Wickramanayaka, Director, Interconnects and Advanced Packaging-Special Projects, A*STAR Institute of Microelectronics
MEMS packaging has evolved from traditional ceramic packaging to wafer level packaging. However, there is no standardized packaging flow as MEMS packaging is more device-specific. This issue is further compounded by the development of advanced MEMS. Wafer level packaging, in which the entire package is formed while MEMS devices are in wafer format, is rapidly growing but to-date, only wafer capping has been commercialized. Wafer level encapsulation and wafer-level chip-scale packaging are other rapidly evolving branches of MEMS packaging. The latter, in particular, is able to support the integration of MEMS and ASIC with the use of TSV.
Wafer level or chip scale bonding is a critical step in MEMS packaging. MEMS device typically needs to be able to move freely in a vacuum or inert gas environment. This is achieved by bonding the MEMS device with a second substrate. The method of required bonding depends on the application of MEMS. Most of the MEMS require hermitic bonding to prevent moisture contamination while some other MEMS need high-vacuum bonding.
As a result of extensive R&D over the last decade, IME has developed advanced packaging technologies supported by innovative bonding techniques. Some of these capabilities will be addressed during the presentation.
Mr Igor Eichinger, Head of Process Engineering, Siconnex
Mr Fred Ishii, Founder, Iron City Micro Display, Inc.
A new micromirror device was developed to minimize (1) form factor, (2) manufacturing cost, and (3) power consumption. The efficiency was achieved by developing (1) vertical cantilever based micromirror hinge, and (2) high speed data transfer (HSVT) methodology to transfer data in loss-less fasion. Micromirror with vertical hinge enables the fabrication of micromirrors with two mechanical components: hinge and mirror, the theoretical minimum. HSVT enables 90% reduction in power consumption of digital display backplane while reducing the number of connecting pads by 80%. <Top>
Dr Michael Bolt, Director, NXP Semiconductors
NXP research team has been working on the development of environmental sensor technologies, in and on a standard CMOS process. By integrating these sensors on to a CMOS platform we can then design smart, low power and low cost sensors.