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Event Code:
Date:
Time:
Location:
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STS – S4
Friday,21 May 2010
14:00–17:00
Level 3, Suntec Singapore
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[14:00–14:45]
Keynote
The Challenges of Wafer Level Fan Out Packaging
Mr. Andreas Bahr
Director WLD
Infineon Technologies AP Pte Ltd
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[14:45–15:15]
Design for Reliability of WLP
Dr. Tee Tong Yan
Deputy R&D
Director
Nepes Pte Ltd
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[15:15–15:30]
Break
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[15:30 – 16:00]
Pac Tech Asia Sdn Bhd
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[16:00–16:30]
Reliable Separation of devices for WL- Fan Out Technology
Mr. Ganesh Vetrivel
Senior Staff Engineer
Infineon Technologies
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[16:30 – 17:00]
Multi die eWLB – A Novel Approach to SIP
Mr. Christian Geissler
Project Manager eWLB
Infineon Technologies AG
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Programmes are subject to change without prior notice
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