Event Code:
Date:
Time:
Location:
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STS – S1
Thursday, 20 May 2010
09:30–13:00
Level 3, Suntec Singapore
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Session Chair
Mr. Charles Vath
Vice President, Process and Package Development
ASM Pacific Technology Ltd
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[09:20 – 09:30]
Semi Address and Introduction
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[09:30–10:15]
Keynote: STM 3D-IC Package and 3D Fan-out eWLB Development
Mr. Jin Yonggang
Engineering Manager
STMicroelectronics
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[10:15 – 10:45]
Three – Dimensional Fan – Out Packaging and Heterogeneous Integration
Mr. Glenn Daves
Director
Packaging Solutions Development
Freescale Semiconductor Inc
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[10:45–11:15]
Next Generation Wafer Level Packaging Solution for 3D Integration
Dr S.W. Yoon
Deputy Director
STATS CHIPPAC LTD
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[11:15–11:30]
Break
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[11:30–12:00]
High Accuracy Die to Wafer (D2W) Placement and Bonding Enabling High Density and Fine Pitch in 3D- IC with High Density TSV
Mr. Gilbert Lecarpentier
Business Development Manager
Smart Equipment Technology
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[12:00–12:30]
Integrated, High Reliability 3D- IC TSV Processing
Mr. Ian Wright
Senior Director of Asia Business Development
SPP Process Technology Systems Ltd
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[12:30–13:00]
Copper Deposition for Robust TSV Fill
Dr Jonathan Reid
Fellow
Novellus Systems, Inc.
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