Event Code:
Date:
Time:
Location:
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STS – S3
Thursday, 20 May 2010
14:00 – 16:30
Level 3, Suntec Singapore
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Session Chair:
Dr. Johnny Yeung
R&D Director
Heraeus Materials Singapore Pte Ltd
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[13:50 – 14:00]
Semi Address and Introduction
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[14:00–14:45]
Keynote: Technology Trends in Wafer Level Packaging
Dr. Vaidyanathan Kripesh
Senior Member of Technical Staff
Institute of Microelectronics
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[14:45–15:15]
Large eWLB – How to Realize Reliable Large Packages
Dr. Andreas Wolter
Project Leader eWLB
Infineon Technologies AG
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[15:15- 15:30]
Break
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[15:30- 16:00]
Integrated Wafer Level Packaging – An Emerging Synergism
Mr. John Hunt
Director of Engineering
ASE (U.S.) Inc.
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[16:00- 16:30]
Compression Encapsulation – The Next Step
Mr. Eric Kuah
Technical Director
ASM Technology Singapore Pte. Ltd.
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