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Event Code:
Date:
Time:
Location:
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STS – S2
Friday, 21 May 2010
09:30–13:00
Level 3, Suntec Singapore
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Session Chair:
Mr. Teo Keng Hwa
Industry Development Manager
Institute of Microelectronics
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[09:20 – 09:30]
Semi Address and Introduction
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[09:30-10:15]
Keynote: Opportunities in 3D packaging
Mr. Navas Khan
Principal Investigator, Advanced Packaging
Institute of Microelectronics Singapore
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[10:15-10:45]
Opportunites and Challenges for 3D ICs
Dr Kao Ming-Jer
Deputy General Director
ITRI/EOL
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[10:45-11:15]
CMP Slurries and Spin-on Dielectrics Materials for TSV application
Dr Yutaka Nomura
Researcher
Hitachi Chemical Co. Ltd
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[11:15- 11:30]
Break
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[11:30- 12:00]
Temporary Bonding Solutions
Mr. Erwin Hell
SUSS Microtec
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[12:00- 12:30]
Temporary Bonding and Debonding Technology – Challenges & Achievements
Mr Markus Wimplinger
Corporate Technology Development and IP Director
EV Group E. Thallner GmbH
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[12:30- 13:00]
Advance Packaging Materials for 3D Packages
Mr. Tan Tat Hong
General Manager R&D
Sumitomo Bakelite Pte Ltd
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Programmes are subject to change without prior notice
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